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Back grinding protective tape for semiconductor wafers
Back grind tape is used to protect the circuit surface from contamination such as scratches, chipping, cracks, and contamination caused by external foreign substances during the back grinding of the wafer's backside. - Excellent adhesion to uneven wafers such as circuit surfaces - Excellent peelability
Achieves stable low particle characteristics, eliminating the need for cleaning processes! Adheres closely to the uneven surfaces of the wafer circuit!
"Back Grind Tape" is a tape that can protect the circuit surface during the grinding of the wafer's backside. Designed with an adhesive that does not require a cleaning process, it combines low particle generation and stable grindability. It has minimal changes in adhesive strength over time, ensuring stable release properties. 【Features】 ■ Excellent adhesion to the unevenness of the wafer circuit surface ■ Stable grindability during back grinding (low TTV) ■ Eliminates the need for a cleaning process by achieving stable low particle characteristics ■ Minimal changes in adhesive strength over time, ensuring stable release properties *For more details, please refer to the PDF document or feel free to contact us.
